JPH01107129U - - Google Patents
Info
- Publication number
- JPH01107129U JPH01107129U JP1988001579U JP157988U JPH01107129U JP H01107129 U JPH01107129 U JP H01107129U JP 1988001579 U JP1988001579 U JP 1988001579U JP 157988 U JP157988 U JP 157988U JP H01107129 U JPH01107129 U JP H01107129U
- Authority
- JP
- Japan
- Prior art keywords
- cleaning brush
- substrate surface
- rotating
- cleaning
- descended
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988001579U JPH01107129U (en]) | 1988-01-08 | 1988-01-08 | |
| KR1019890000131A KR920010691B1 (ko) | 1988-01-08 | 1989-01-07 | 접촉완충장치 부착 세정장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988001579U JPH01107129U (en]) | 1988-01-08 | 1988-01-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01107129U true JPH01107129U (en]) | 1989-07-19 |
Family
ID=11505425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988001579U Pending JPH01107129U (en]) | 1988-01-08 | 1988-01-08 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH01107129U (en]) |
| KR (1) | KR920010691B1 (en]) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0352228A (ja) * | 1989-07-20 | 1991-03-06 | Tokyo Electron Ltd | 洗浄装置 |
| JPH07323266A (ja) * | 1994-05-31 | 1995-12-12 | Nisshin Steel Co Ltd | 金属帯表面の付着塵埃の吸引除去方法および装置 |
| JPH08141518A (ja) * | 1994-09-20 | 1996-06-04 | Dainippon Screen Mfg Co Ltd | 回転式基板洗浄装置 |
| JP2021019130A (ja) * | 2019-07-22 | 2021-02-15 | 株式会社荏原製作所 | 基板洗浄装置および基板洗浄方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100403517B1 (ko) * | 2000-12-29 | 2003-10-30 | (주)케이.씨.텍 | 웨이퍼 세정 장치 |
| CN111002164B (zh) * | 2019-12-09 | 2020-11-17 | 国网智能科技股份有限公司 | 一种变电站触头打磨机构、打磨机器人、系统及方法 |
-
1988
- 1988-01-08 JP JP1988001579U patent/JPH01107129U/ja active Pending
-
1989
- 1989-01-07 KR KR1019890000131A patent/KR920010691B1/ko not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0352228A (ja) * | 1989-07-20 | 1991-03-06 | Tokyo Electron Ltd | 洗浄装置 |
| JPH07323266A (ja) * | 1994-05-31 | 1995-12-12 | Nisshin Steel Co Ltd | 金属帯表面の付着塵埃の吸引除去方法および装置 |
| JPH08141518A (ja) * | 1994-09-20 | 1996-06-04 | Dainippon Screen Mfg Co Ltd | 回転式基板洗浄装置 |
| JP2021019130A (ja) * | 2019-07-22 | 2021-02-15 | 株式会社荏原製作所 | 基板洗浄装置および基板洗浄方法 |
| TWI848150B (zh) * | 2019-07-22 | 2024-07-11 | 日商荏原製作所股份有限公司 | 基板清洗裝置及基板清洗方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR890012358A (ko) | 1989-08-26 |
| KR920010691B1 (ko) | 1992-12-12 |